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  1. 0 資料タイプ別
  2. 01 学術雑誌論文
  1. 230 大学院自然科学研究科
  2. 10 学術雑誌論文
  3. 10 査読済論文

無酸素銅の拡散接合部に及ぼす接合面での結晶方位差の影響

http://hdl.handle.net/10191/6414
http://hdl.handle.net/10191/6414
5ffb1635-6b01-4680-93f5-53bcfa06562d
名前 / ファイル ライセンス アクション
06_0001.pdf 06_0001.pdf (1.5 MB)
Item type 学術雑誌論文 / Journal Article(1)
公開日 2008-04-23
タイトル
タイトル 無酸素銅の拡散接合部に及ぼす接合面での結晶方位差の影響
言語
言語 jpn
キーワード
主題Scheme Other
主題 Copper diffusion bonding
キーワード
主題Scheme Other
主題 single crystal
キーワード
主題Scheme Other
主題 misorientation angle
キーワード
主題Scheme Other
主題 bonding boundary
キーワード
主題Scheme Other
主題 low angle boundary
キーワード
主題Scheme Other
主題 high angle boundary
キーワード
主題Scheme Other
主題 low angle boundary
資源タイプ
資源 http://purl.org/coar/resource_type/c_6501
タイプ journal article
その他のタイトル
その他のタイトル Effect of Misorientation Angle at Bonded Interface on Diffusion Bonding Joints Using Oxygen Free High Conductor Copper
著者 大橋, 修

× 大橋, 修

WEKO 47955

大橋, 修

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吉岡, 隆幸

× 吉岡, 隆幸

WEKO 47956

吉岡, 隆幸

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新田, 勇

× 新田, 勇

WEKO 58

新田, 勇

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古田, 徳秋

× 古田, 徳秋

WEKO 47958

古田, 徳秋

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著者別名
識別子 47959
識別子Scheme WEKO
姓名 Ohashi, Osamu
著者別名
識別子 47960
識別子Scheme WEKO
姓名 Yoshioka, Takayuki
著者別名
識別子 58
識別子Scheme WEKO
姓名 Nitta, Isami
著者別名
識別子 47962
識別子Scheme WEKO
姓名 Furuta, Noriaki
抄録
内容記述タイプ Abstract
内容記述 The aim of this study is to investigate the effect of misorientation angle at bonded boundary on the tensile properties and the interface energy at the bonded boundary. The interface energy was evaluated with an observation of dihedral angle of the groove with a free surface which was achieved by thermal etching. The misorientation angle at the bonded boundary was measured by the electron channelling pattern method. The results obtained are as follows. (1) The interface energy at the bonded boundary depends on the misorientation angle at the bonded boundary, the bonding temperature and the thickness of surface oxide film. But the fracture strength does not depend on the misorientation angle. (2) The interface energy at the low angle bonded boundary below 5° is lower than that at the grain boundary in the base metal. The interface energy at the high angle bonded boundary at 18 up to 30°is higher than that in the base metal. (3) The interface energy of bonded boundary decreases with an increase in bonding temperature and a decrease in thickness of surface oxide film. (4) The number of void at the low angle bonded boundary is fewer than that at the high angle bonded boundary after the thermal etching, the size of the void is smaller than that at the high angle bonded boundary. The number and size decrease with an increase in the bonding temperature.
書誌情報 溶接学会論文集
en : 溶接学会論文集

巻 18, 号 2, p. 324-330, 発行日 2000-05
出版者
出版者 溶接学会
ISSN
収録物識別子タイプ ISSN
収録物識別子 02884771
書誌レコードID
収録物識別子タイプ NCID
収録物識別子 AN1005067X
著者版フラグ
値 publisher
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