2024-03-29T04:51:01Z
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2022-12-15T03:36:48Z
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セラミックスの研削残留応力分布のX線的研究
セラミックスの研削残留応力分布のX線的研究
X-ray Study of Residual Stress Distribution of Ground Ceramics
坂井田, 喜久
田中, 啓介
幾原, 雄一
鈴木, 賢治
Ceramics
Residual Stress
Grinding
X-ray Stress Measurement
Dislocation
Glancing Incidence X-ray Diffraction Method
Transmission Electron Microscopy
The residual stress distribution of ground ceramics was determined from the eigen strain existing in the ground surface. The eigen strain of ground ceramics was tensile, and exponentially decreased with the distance from the surface. The residual stress distribution is given as a superposition of all exponential function of compression and a linear function. It is found that the actual residual stress distribution call be approximated by a compressive exponential function because the magnitude of tensile residual stress is negligibly small compared to the compressive residual stress. In the experiments, the diffraction angle was measured on ground silicon nitride for a wide range of sin^3Φ using the glancing incidence X-ray diffraction technique. A strong nonlinearity was found in the 2θ-sin^2Φ diagram at very high Φ-angles. From the analysis of nonlinearity, the residual stress distribution was determined. The residual stress distribution of silicon nitride coincided with the distribution calculated from the eigen strain distribution. Transmission electron microscopy was used to clarify the origin of generation of the residual stress. Both strain contrasts and microcracks were observed below the ground surface : straight dislocations were also observed within silicon nitride grains near the ground surface.
日本機械学会
1997-08
jpn
journal article
http://hdl.handle.net/10191/18182
https://niigata-u.repo.nii.ac.jp/records/3687
AN0018742X
03875008
日本機械学会論文集. A編
日本機械学会論文集. A編
63
612
1681
1687
https://niigata-u.repo.nii.ac.jp/record/3687/files/63-612_1681.pdf
application/pdf
1.2 MB
2019-07-30